Line width and spacing |
|
|---|---|
| Minimum Line Spacing (Internal) |
.001" |
| Minimum Line Width (External) |
.001" |
| Minimum Line Spacing (External) |
.001" |
| Minimum Via Size |
.004" Drilled |
| Maximum Aspect Ratio |
28:1 |
| Controlled Impedance Tolerance |
+/- 5% |
| Buried Capacitance |
Yes |
| Buried Resistance |
Yes |
| Maximum Layer Count |
Design Dependent |
| Minimum Thickness |
.001" |
|
Click HERE to learn about our Sub 1 Mil lines and Spaces |
|
Via capabilities |
|
|---|---|
| Microvias |
Yes |
| Copper Filled Microvias |
Yes |
| Buried Vias |
Yes |
| Blind Vias |
Yes |
Final surface finishes |
|
|---|---|
| Selective Soft Gold |
Yes |
| Selective Hard Gold |
Yes |
| Electroless Nickel Immersion Gold |
Yes |
| ENEPIG |
Yes |
| HASL |
Yes |
| Fused Sn/Pb |
Yes |
| OSP |
Yes |
| Palladium-Nickel |
Yes |
| Immersion Tin |
Yes |
| Immersion Silver |
Yes |
| High Tg 170 FR-4 |
Yes |
Materials |
|
|---|---|
| Polyimide |
Yes |
| Rogers |
Yes |
| Taconic |
Yes |
| Nelco |
Yes |
| Stablcor |
Yes |
| Ohmega Ply Resistive Foils |
Yes |
| Copper-Invar-Copper |
Yes |
| Aluminum/ Copper Heat Sinks |
Yes |