The traditional subtractive etch process for manufacturing printed circuit boards becomes much less reliable when working with features that are sub 1 mil. There has been a new additive process developed that uses a precursor ink to break through these barriers and meets four market needs:
1. Fine line (< 25 micron) Additive (Rigid and flex PCB)
- Precursor ink makes the additive process practical
- Additive process makes the fine lines practical
- This process works well with existing manufacturing equipment
- Cost savings over conventional processing can be 35%-60%
2. Via excellence (Rigid PCB)
- Precursor ink is the key advantage
- Reduces electroless usage by 60% or more
- Reduces the use of water by 60% or more
- Lower cost than conventional processing
3. Stacked microvia excellence (Rigid/Flex PCB)
- Better results than conventional processing
- Precursor ink is the key advantage
- Eliminates the need for sequential lamination
- Cost savings can be 20%-30%
4. Selective via plating (Multilayer rigid PCB)
- Precursor ink and ink blocker are the keys
- Eliminates the need for sequential lamination processing
- Cost savings can be 20%-60%
This process can be used as a stand-alone technology or in conjunction with the traditional subtractive etch process. Please contact us if you are interested in learning more!