IPC and MIL SPEC for Printed Circuit Boards

There are two types of specs commonly used in the PCB industry: IPC and the MIL Spec. Here is a handy reference guide:
IPC-SPECS:

  • IPC-6013 – Qualification and Performance Specification for Flexible Printed Boards
  • IPC-T-50 – Terms and Definition
  • IPC-MF-150 – Metal Foil for Printed Wiring Applications
  • IPC-FC-231 – Flexible Bare Dielectrics for Use in Flexible Printed Wiring
  • IPC-FC-232 – Specification for Adhesive Coated Dielectric Films For Use as Cover Sheets for Flexible Printed Wiring
  • IPC-FC-241 – Flexible Metal Clad Dielectrics for use in Fabrication of Flexible Printed Wiring
  • IPC-SM-840 – Qualification and Performance of Permanent Solder Mask
  • IPC-2221 – Generic Standard on Printed Board Design
  • IPC-2223 – Sectional Design Standard for Flexible Printed Boards
  • IPC-4101 – Laminate/Prepreg Materials Standard for Printed Boards
  • IPC-6011 – Generic Performance Specification for Printed Boards
  • IPC-6012 – Qualification and Performance Specification for Rigid Printed Boards
  • J-STD-001 – Requirements for Soldered Electrical and Electronics Assemblies
  • J-STD- 002 – Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
  • J-STD-003 – Solderability Tests for Printed Boards
  • J-STD -004 – Requirements for Soldering Fluxes
  • J-STD- 005 – General Requirements and Test Methods for Electronic Grade Solder Paste
  • J-STD-006 – General Requirements and Test Methods for Soft Solder Alloys and Fluxed and Non-Fluxed Solid Solder for Electronic Soldering Applications

MIL-SPECS

  • MIL-P-50884 – Flex Manufacturing and Performance
  • MIL-STD-2118 – Flex Design Standard
  • MIL-STD-105 – Sampling Procedures and Inspection Tables
  • MIL-STD-129 – Marking for Shipment and Storage
  • MIL-STD-130 – Identification for Marking
  • MIL-STD-202 – Test Methods for Electronic Equipment
  • MIL-STD-2000 – Soldering and Assembly
  • MIL-STD-45662 – Calibration System Requirements
  • DOD-D-1000 – Engineering Drawings
  • DOD-STD-100 – Engineering Drawing Practices
  • ANSI-Y-145 – Dimensioning and Tolerancing
  • MIL-S-13949 – Plastic Sheet, Laminate, Metal Clad (for PWB’s)
  • MIL-C-14550 – Copper Plating (Electrodeposited)
  • MIL-I-43553 – Ink Marking, Epoxy Base
  • MIL-G-45204 – Gold Plating (Electrodeposited)
  • MIL-I-45208 – Inspection System Requirements
  • MIL-Q-9858 – Quality Program Requirements
  • MIL-P-81728 – Plating Tin Lead (Electrodeposited)
  • MIL-P-55110 – Printed Wiring Boards
  • QQ-N-290 – Nickel Plating (Electrodeposited)

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