There are two types of specs commonly used in the PCB industry: IPC and the MIL Spec. Here is a handy reference guide:
IPC-SPECS:
- IPC-6013 – Qualification and Performance Specification for Flexible Printed Boards
- IPC-T-50 – Terms and Definition
- IPC-MF-150 – Metal Foil for Printed Wiring Applications
- IPC-FC-231 – Flexible Bare Dielectrics for Use in Flexible Printed Wiring
- IPC-FC-232 – Specification for Adhesive Coated Dielectric Films For Use as Cover Sheets for Flexible Printed Wiring
- IPC-FC-241 – Flexible Metal Clad Dielectrics for use in Fabrication of Flexible Printed Wiring
- IPC-SM-840 – Qualification and Performance of Permanent Solder Mask
- IPC-2221 – Generic Standard on Printed Board Design
- IPC-2223 – Sectional Design Standard for Flexible Printed Boards
- IPC-4101 – Laminate/Prepreg Materials Standard for Printed Boards
- IPC-6011 – Generic Performance Specification for Printed Boards
- IPC-6012 – Qualification and Performance Specification for Rigid Printed Boards
- J-STD-001 – Requirements for Soldered Electrical and Electronics Assemblies
- J-STD- 002 – Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
- J-STD-003 – Solderability Tests for Printed Boards
- J-STD -004 – Requirements for Soldering Fluxes
- J-STD- 005 – General Requirements and Test Methods for Electronic Grade Solder Paste
- J-STD-006 – General Requirements and Test Methods for Soft Solder Alloys and Fluxed and Non-Fluxed Solid Solder for Electronic Soldering Applications
MIL-SPECS
- MIL-P-50884 – Flex Manufacturing and Performance
- MIL-STD-2118 – Flex Design Standard
- MIL-STD-105 – Sampling Procedures and Inspection Tables
- MIL-STD-129 – Marking for Shipment and Storage
- MIL-STD-130 – Identification for Marking
- MIL-STD-202 – Test Methods for Electronic Equipment
- MIL-STD-2000 – Soldering and Assembly
- MIL-STD-45662 – Calibration System Requirements
- DOD-D-1000 – Engineering Drawings
- DOD-STD-100 – Engineering Drawing Practices
- ANSI-Y-145 – Dimensioning and Tolerancing
- MIL-S-13949 – Plastic Sheet, Laminate, Metal Clad (for PWB’s)
- MIL-C-14550 – Copper Plating (Electrodeposited)
- MIL-I-43553 – Ink Marking, Epoxy Base
- MIL-G-45204 – Gold Plating (Electrodeposited)
- MIL-I-45208 – Inspection System Requirements
- MIL-Q-9858 – Quality Program Requirements
- MIL-P-81728 – Plating Tin Lead (Electrodeposited)
- MIL-P-55110 – Printed Wiring Boards
- QQ-N-290 – Nickel Plating (Electrodeposited)
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