For those of you wondering “what is all the fuss about micro vias”, we have put together a short list of “the basics”.
What is a Micro Via?
A blind connection between two layers, usually adjacent, hole of .006″ or less, typically drilled with laser technology.
Why use Micro Via Technology?
- Fine pitch devices
- Limited real estate
- High levels of interconnect
- Reduced hole sizes
- Reduced pad sizes
- More direct signal path
- Improved reliability by changing technology rather than pushing older technology limits
Types of Micro Via constructions:
Staggered: Micro Vias are staggered, or offset, from layer to layer
Stacked: Micro Vias are “stacked” on top of each other. This allows greater design density
Skip: Micro Vias from L1-L3 rather than L1-L2, L2-L3. This reduces the number of required lamination cycles
ELIC: Every layer Inter Connect
Benefits of Micro Via Construction:
- Smaller PCB’s
- Improved electrical performance
- Improved reliability
- Thinner construction
- Lighter weight
- Space savings
- RF line termination
- Lower layer count
As always, please contact us for more information. Designing and purchasing printed circuit boards should not be difficult!