We are periodically asked about the acceptance criteria for cap
Ormet Paste – Making Z-Axis connections during lamination
Paste instead of plating ~ something to think about….. We
Pad Cratering: The Basics
Pad cratering, what is it? Pad cratering is defined as
PCB Material Data Sheets
For all of our friends that feel just a little
Benefits of a fine line additive PCB process
The traditional subtractive etch process for manufacturing printed circuit boards
Flex Circuit Shielding Options
Shields are often needed when an application requires limits in
.4 mm device routing – PCB
Here is an example for routing a .4 mm pitch
Circuitry on a balloon catheter
Advantage to Additive Fine Line PCB manufacturing process: Medical Device:
IPC and MIL SPEC for Printed Circuit Boards
There are two types of specs commonly used in the
Sub 1 Mil Line and Space
Breakthrough in fine line metallization IC packaging and high end